LITEON Technology (2301) will participate in the Open Compute Project (OCP) Global Summit from October 13–16 in San Jose, California—marking its fourth consecutive year at the event. With an expanded presence, LITEON reaffirms its commitment to advancing next-generation data center infrastructure. This year, the company will unveil a comprehensive portfolio of integrated solutions, including power management systems, rack designs, and liquid cooling technologies optimized for future AI workloads. On October 14, LITEON will deliver two keynote sessions, offering in-depth insights into the evolving technologies shaping AI infrastructure. In response to the rising challenges of megawatt-level rack power demands—particularly from next-generation NVIDIA AI infrastructure—LITEON will showcase rack-level integrated solutions supporting NVIDIA’s next-gen platforms, including NVIDIA MGX and the ORV3 open architecture. These solutions reflect LITEON’s holistic approach to power, mechanical, and thermal management, addressing the physical and thermal limits of high-density data centers and reinforcing its role as a key innovator in scalable, efficient, and sustainable AI infrastructure.
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LITEON and NVIDIA Collaborate on NVIDIA GB300 NVL72 Platform, Reducing AI Training Grid Peak Load by 30% |
As AI applications continue to expand and computing power demands surge, power supply from the grid to data centers requires not only sufficient total capacity but also stability and instantaneous peak load regulation. With over four decades of expertise in power technology, LITEON provides power management solutions for diverse application scenarios. At the 2025 OCP Summit, LITEON will unveil comprehensive solutions covering next-generation 800 VDC architecture, Power Shelf, high-efficiency backup power systems (BBU), and modular power supplies—enabling customers to build high-performance, low-energy, and scalable AI infrastructure. In addition, LITEON and NVIDIA have collaborated on the NVIDIA GB300 NVL72 platform, which significantly reduces grid peak demand and enhances power stability through energy storage, power capping, and GPU load management. This innovative design effectively reduces the impact of power fluctuations on AI training, with test results showing a 30% reduction in grid peak load. (For details, please refer to: How New GB300 NVL72 Features Provide Steady Power for AI )
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LITEON Demonstrates High-Density AI Liquid Cooling Integrated Solutions, Enhancing Data Center Energy Efficiency and Reliability, Setting a New Standard for Rack Cooling |
With the rapid advancement of AI and HPC, traditional cooling architectures can no longer meet the demands of high-density computing power, and liquid cooling technology is rapidly emerging as mainstream. Leveraging its integration capabilities in power, mechanical, and thermal management, Working with NVIDIA, LITEON has developed complete liquid cooling integrated solutions for high-density AI workloads, specifically for NVIDIA MGX and ORV3 architectures, offering modular designs that can support high-density racks up to 3 metric tons. To ensure long-term stable operation, LITEON’s liquid cooling system incorporates multi-point real-time monitoring of key data such as flow rate and temperature, providing highly efficient thermal pipeline redundancy. This ensures maintaining backup capability even under high thermal loads, greatly enhancing system reliability and maintenance efficiency. At this year’s OCP Summit, LITEON will showcase liquid cooling integrated solutions, including 2.1MW in-Row CDU, 280kW in-Rack CDU, 140kW Liquid to Air Sidecar. Compared to traditional cooling, liquid cooling can significantly reduce PUE and free up more rack space, creating dual benefits in energy efficiency and space optimization for data centers.
In response to the significant power and cooling challenges brought by AI applications, LITEON leverages its core expertise in power management, mechanical, and liquid cooling. Through advancements in high-wattage power systems, modular rack designs, and liquid cooling systems, LITEON provides comprehensive solutions that empower customers to meet the demands of future megawatt-scale NVIDIA AI factories and build smart data centers that are efficient, reliable, and sustainable. For more information, please visit: https://www.liteon.com/zh-tw/solutions/green-data-center。
LITEON Technology 2025 OCP Global Summit Exhibition Information:
Date: October 13–16, 2025
Venue: San Jose McEnery Convention Center, USA
Booth: B32
LITEON Technology 2025 OCP Global Summit Speech Information:
Date & Time: October 14, 2025, 14:45–15:10
Location: Concourse Level – 210CDGH
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