May 20-23, 2025 - LITEON Technology (2301) participated in COMPUTEX 2025, under the theme "LITEON Power AI". LITEON will showcase integrated cabinet power management and liquid cooling solutions specifically designed for NVIDIA GB200 NVL72, NVIDIA GB300 NVL72, and next-generation NVIDIA Rubin systems. These solutions aim to help customers accelerate the integration of new-generation AI infrastructure, creating high-efficiency and energy-saving data centers to address the growing challenges of computing power, energy, and cooling in the AI era. LITEON will present several innovative solutions, including: NVIDIA MGX next-generation compliant 55 kW rack power (Power Shelf), 33kW high-efficiency backup power system (BBU), 1MW Power Rack, 20kW Capacitor Shelf; as well as liquid cooling solutions: Liquid to Air 140kW Sidecar, NVIDIA MGX NVL72 compliant high-density, high-performance cooling system (120kW in-rack CDU), and 2.1MW in-row CDU.
"LITEON has closely collaborated with NVIDIA, from NVIDIA MGX GB200, GB300 to Rubin Vera, and next-generation Rubin Ultra. To respond to NVIDIA's multi-generational product synchronous development pace, LITEON provides high-density, flexible, and modular design solutions to help customers gain speed and scale advantages in the AI era," said Anson Chiu, President of LITEON Technology.
LITEON has unveiled its 800V High Voltage Direct Current (HVDC) solution, developed in collaboration with NVIDIA. This solution is designed to elevate voltage from 50V to 800V to meet the power requirements of IT Rack. This innovative design not only efficiently supplies the operating voltage needed for chips but also simultaneously reduces current, thereby minimizing energy loss and cable size, and addressing heat dissipation issues. Once the 800V HVDC enters the system, it can further be converted to 50V or 12V.
LITEON's latest power management solutions demonstrate high performance and high-density design capabilities, utilizing Silicon Carbide (SiC), Gallium Nitride (GaN) devices and high-efficiency topologies to significantly improve power conversion efficiency and power density, enhancing LITEON's power solutions' competitiveness in AI servers and high-performance computing (HPC). LITEON's power solutions rapidly evolve from distributed modules to rack-level, centralized Power Shelf solutions, integrating BBU and liquid cooling technologies to form a comprehensive Rack Power solution. This modular and centralized design not only improves system energy efficiency indicators (PUE; Power Usage Effectiveness) but also enhances application stability and security.
LITEON's liquid cooling integration solutions are specifically designed for NVIDIA MGX architecture, paired with a high-load cabinet system capable of supporting up to 3 metric tons, covering in-Rack CDU, Sidecar, and in-Row CDU, offering modular, quickly deployable high-efficiency cooling solutions that support diverse application scenarios from edge to large data centers, suitable for AI, HPC, LLM, and other high-density computing needs. Additionally, aiming to achieve sustainable green data centers, these solutions reduce PUE and TCO (Total Cost of Ownership). Furthermore, LITEON's cold plate cooling technology uses copper heat sinks and microchannel technology to effectively conduct and dissipate heat generated by high-power components, ensuring stable system operation. For rack-level liquid cooling manifolds, LITEON's solutions equipped with high-precision manufacturing and welding technology, comply with OCP ORV3 and NVIDIA MGX specifications, featuring blind-mate quick connectors, leak-proof design, and tool-free maintenance, ensuring high reliability in application quality as well as assisting customers in building scalable and easy-to-maintain data centers.
Leveraging its deep core technology in advanced power management, innovative mechanical design, and core competitive advantages in software and hardware integration, LITEON is committed to creating the best AI computing experience to meet customers' high-performance AI computing needs in data centers.
For more information on LITEON's data center power solutions and liquid cooling solutions, please visit https://liteon-cips.com/
Press Contact
Irene Chou
Chizuru Iizuka
Corporate Brand Value Development Center
+886-2-8798-2888
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