LITEON to Participate in Supercomputing (SC25) For the Fourth Consecutive Year Showcasing Integrated Solutions for High-Performance Computing

LITEON Technology (2301-tw) will head to St. Louis, USA from November 16 to 21 to participate in the Supercomputing (SC25) event for the fourth consecutive year. With a focus on AI servers and data center applications, LITEON will showcase a range of integrated AI infrastructure solutions. As AI server power demands continue to surge, energy and thermal management have become core challenges for data centers. Building on the technology showcased at the October OCP Global Summit, LITEON will demonstrate the latest advancements from next-generation high-voltage power delivery to megawatt-level liquid cooling integration. Highlights include 800 VDC architecture power solution and liquid-cooled, high-density rack systems, BBU, and enterprise-grade power system integration solutions—along with high-power-density power modules, rack-level power systems, and liquid cooling thermal designs supporting the ORV3 open architecture. These innovations demonstrate LITEON’s system integration capabilities in high-density computing environments.

With the rapid growth of AI and high-performance computing demands, data centers face challenges in power density, cooling efficiency, and deployment flexibility. Leveraging its core strengths in power management, mechanical design, and liquid cooling technologies, LITEON introduces a series of rack-level solutions designed to support megawatt-scale computing platforms. These solutions deliver both stability and energy efficiency, enhancing data center performance in high-density deployments and operations:

• Power Systems: Designed with high power density, combining high-efficiency energy conversion and modular architecture to stably support high-load computing.
• Mechanics Design: Incorporates modular and high-density configurations to improve space utilization and maintenance efficiency.
• Liquid Cooling Systems: Equipped with multi-point monitoring and redundancy design to enhance system reliability and thermal management performance, meeting the cooling and stability needs of high-power computing.

SC25 is the flagship annual event in the global high-performance computing arena, leading the development direction of AI and data center technologies. LITEON returns this year to showcase integrated solutions covering power modules, mechanics design, and liquid cooling systems, responding to the industry’s high demand for power density, energy efficiency, and system stability. Through technology integration and architecture optimization, LITEON helps customers address the challenges of rapid AI application expansion and computing environment upgrades, building scalable, efficient, and sustainable infrastructure. For more information, please visit: https://www.liteon.com/zh-tw/solutions/green-data-center

LITEON Technology at Super Computing 2025:

Date: November 16–21, 2025

Venue: America’s Center, St. Louis, USA

Booth: #3832

Press Contact

Corporate Brand Value Development Center 

Irene Chou

Chizuru Iizuka

Tel: 02-8798-2888

LITEONTech.PR@liteon.com